・ Machine housings and enclosures: Used to protect the external structure of semiconductor equipment; they typically require good heat dissipation and antistatic properties.
・ Brackets and bases: Used to support the structure of semiconductor equipment, ensure stable operation, and provide necessary mounting interfaces.
・ Conductive plates: Used for connecting and transmitting electrical signals; they generally require good conductivity and corrosion resistance.
・ Protective covers: Used to prevent external interference and protect sensitive components, especially in high-frequency or high-precision applications.
・ Grounding plates: Used to provide reliable grounding connections, ensuring equipment safety and stability.
・ Module frames: Used to assemble and secure semiconductor modules, ensuring stability during operation.